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Clean Room Oven
Clean Room Oven Clean Room Oven
Clean Room Oven Clean Room Oven

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Clean Room Oven

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The Cleanroom Oven is a specialized thermal processing equipment engineered for controlled clean environments, designed to perform heating, drying, curing, and baking of contamination-sensitive products without introducing particulate or microbial pollutants. Equipped with high-efficiency air filtration systems and low-outgassing materials, it maintains strict cleanroom standards (Class 10 to Class 1000) during operation, making it indispensable for industries where product purity directly impacts yield and quality, such as semiconductor manufacturing, pharmaceutical production, and precision electronics assembly .
  • DBT-273

  • Danble

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Overview
As a critical equipment in cleanroom production lines, our Cleanroom Oven integrates advanced thermal control technology with contamination prevention design. It replaces traditional ovens that risk particle emission, ensuring thermal processing (drying, curing, annealing) is conducted under ultra-clean conditions. The oven’s structure and materials comply with GB/T36066—2025 cleanroom equipment standards , providing reliable support for high-precision manufacturing and R&D scenarios.
Core Features
  • Ultra-Clean Performance: Equipped with H14 HEPA filters (air change rate ≥20 times/hour) and stainless steel (316L) inner chamber with smooth rounded corners, minimizing particle accumulation and ensuring Class 10-1000 clean grade (customizable to Class 1). Particle count <0.5μm particles ≤10pcs/ft³ during operation .

  • Precise Thermal Control: Adopts PID microprocessor control system with temperature range of RT+10℃~300℃ (optional up to 500℃) and temperature uniformity of ±1℃. Supports programmable temperature curves (up to 10 segments) for complex heating processes.

  • Contamination Prevention Design: Low-outgassing insulation materials, silicone-free seals, and heated door glass (prevents condensation) avoid secondary contamination. Airflow is optimized to ensure uniform temperature without turbulence-induced particle disturbance.

  • Safety & Compliance: Equipped with over-temperature alarm (±5℃ deviation), over-pressure protection, and door interlock system. Inner chamber is easy to sterilize (compatible with UV sterilization) to meet pharmaceutical GMP requirements .

  • Flexible Configuration: Available in bench-top (50L-200L) and walk-in (1000L-10000L) models. Optional features include nitrogen purge system (for oxygen-sensitive materials) and RS485 data interface (for batch traceability).

Typical Application Fields
  • Semiconductor Industry: Drying photoresist on wafers, curing semiconductor packaging materials, and annealing precision electronic components—critical for improving chip yield by avoiding particle-induced defects .

  • Pharmaceutical & Medical: Drying pharmaceutical powders, sterilizing medical device components, and curing bio-optoelectronic materials—complying with sterile production standards .

  • Precision Electronics: Processing LCD panel components, drying capacitor electrolytes, and curing adhesive on circuit boards—preventing moisture-induced performance failure.

  • Aerospace: Heat-treating precision metal parts and curing composite materials in clean environments to ensure structural stability and surface quality.


Model  Interior (WxHxD) Exterior(WxHxD) Liters Heater kW Amp Voltage Temperature Range Cleanliness
DBT-273C 650mm*700mm*600mm
(25.59"*27.56"*23.62")

950mm*1365mm*1230mm

(37.4"*53.74"*48.43")

273 4KW 8A 380/3/50 Ambient  -250°C class1000
DBT-504C

700mm*900mm* 800mm

(27.56"*35.43"*31.5")

1000mm*1560mm1430mm

(39.37"*61.42"*56.3")

504 7KW 14A 380/3/50 Ambient  -250°C class1000
DBT-910C

1300mm*1000mm *700mm

(51.18"*39.37"*27.56")

1600mm*1665mm*1330mm
 (62.99"*65.55"*52.36")
910 10.5KW 21.5A 380/3/50 Ambient  -250°C class1000




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