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DBGN-1000L
Danble
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Precise Thermal Processing in Controlled Vacuum Environments
Our Low-Pressure Vacuum Oven is designed for advanced thermal processing applications requiring low-pressure (vacuum) conditions and precise temperature control. It is widely used in industries such as electronics, aerospace, batteries, and materials science, where outgassing prevention, rapid drying, and controlled heat treatment are critical.
✔ Vacuum Environment Control
Adjustable pressure range: 10⁻⊃3; mbar to 1 atm (customizable).
High vacuum pumping system ensures stable low-pressure conditions.
✔ Precise Temperature Control
Wide temperature range: RT ~ 250°C (or higher, customizable).
Advanced PID controller for stable and uniform heating.
✔ Efficient Drying & Dehydration
Accelerates moisture removal under vacuum, reducing thermal stress.
Ideal for heat-sensitive materials and solvent evaporation.
✔ Outgassing Prevention
Removes trapped gases from materials, improving product purity and performance.
Essential for electronics, batteries, and aerospace components.
✔ Safety & Reliability
Over-temperature protection, vacuum leakage detection, and pressure relief valves.
Corrosion-resistant chamber materials for long-term durability.
✔ Versatile Applications
Electronics: Solder reflow, component drying, encapsulation.
Batteries: Electrode drying, electrolyte filling.
Materials Science: Polymer curing, metal heat treatment.
Research Labs: Chemical synthesis, sample preparation.
Specification
| Product name | Low Pressure Vacuum Oven | ||
Volume | 1000L | ||
| Model | DBGN-1000 | ||
| Interior Dimensions | 1000×1000×1000mm ·(W*D*H) | ||
| Exterior Dimensions | 1550×1600×2100mm · (W*D*H) | ||
| Temperature range | RT + 10℃ ~ + 120℃ Common temperature: 60℃ | ||
| Heating rate | RT+10℃~+120℃ ·≤50min(Under normal pressure) (full average) | ||
| Temperature deviation | ± 2.0℃ · (under atmospheric pressure) | ||
| Temperature uniformity | ± 2.0℃ · (under atmospheric pressure) | ||
| Temperature fluctuation | ±0.5℃ · (under atmospheric pressure) | ||
| Air Pressure control range | under atmospheric pressure～30kpa | ||
| Pressure Precision | ± 2 KPa (at atmospheric pressure ~ 40 KPa), ± 5% (at 40 KPa ~ 4 KPa), ± 0.1 KPa (at 4 KPa ~ 1 KPa) | ||
| Work Noise | 65dB | ||
| Magnetic fluid cooling mode | hydrocooling | ||
✅ Industry-Leading Technology: Engineered for high-precision and reliability.
✅ Customizable Solutions: Tailored pressure, temperature, and chamber size for specific needs.
✅ Global Support: Professional installation, training, and after-sales service.
Electronics: Prevents oxidation during soldering and component assembly.
Batteries: Ensures uniform drying of electrodes for optimal performance.
Aerospace: Removes volatile contaminants from critical components.
Research: Enables controlled chemical reactions and material testing.
For technical specifications, customization options, or a free consultation, please contact our sales team.
Precise Thermal Processing in Controlled Vacuum Environments
Our Low-Pressure Vacuum Oven is designed for advanced thermal processing applications requiring low-pressure (vacuum) conditions and precise temperature control. It is widely used in industries such as electronics, aerospace, batteries, and materials science, where outgassing prevention, rapid drying, and controlled heat treatment are critical.
✔ Vacuum Environment Control
Adjustable pressure range: 10⁻⊃3; mbar to 1 atm (customizable).
High vacuum pumping system ensures stable low-pressure conditions.
✔ Precise Temperature Control
Wide temperature range: RT ~ 250°C (or higher, customizable).
Advanced PID controller for stable and uniform heating.
✔ Efficient Drying & Dehydration
Accelerates moisture removal under vacuum, reducing thermal stress.
Ideal for heat-sensitive materials and solvent evaporation.
✔ Outgassing Prevention
Removes trapped gases from materials, improving product purity and performance.
Essential for electronics, batteries, and aerospace components.
✔ Safety & Reliability
Over-temperature protection, vacuum leakage detection, and pressure relief valves.
Corrosion-resistant chamber materials for long-term durability.
✔ Versatile Applications
Electronics: Solder reflow, component drying, encapsulation.
Batteries: Electrode drying, electrolyte filling.
Materials Science: Polymer curing, metal heat treatment.
Research Labs: Chemical synthesis, sample preparation.
Specification
| Product name | Low Pressure Vacuum Oven | ||
Volume | 1000L | ||
| Model | DBGN-1000 | ||
| Interior Dimensions | 1000×1000×1000mm ·(W*D*H) | ||
| Exterior Dimensions | 1550×1600×2100mm · (W*D*H) | ||
| Temperature range | RT + 10℃ ~ + 120℃ Common temperature: 60℃ | ||
| Heating rate | RT+10℃~+120℃ ·≤50min(Under normal pressure) (full average) | ||
| Temperature deviation | ± 2.0℃ · (under atmospheric pressure) | ||
| Temperature uniformity | ± 2.0℃ · (under atmospheric pressure) | ||
| Temperature fluctuation | ±0.5℃ · (under atmospheric pressure) | ||
| Air Pressure control range | under atmospheric pressure～30kpa | ||
| Pressure Precision | ± 2 KPa (at atmospheric pressure ~ 40 KPa), ± 5% (at 40 KPa ~ 4 KPa), ± 0.1 KPa (at 4 KPa ~ 1 KPa) | ||
| Work Noise | 65dB | ||
| Magnetic fluid cooling mode | hydrocooling | ||
✅ Industry-Leading Technology: Engineered for high-precision and reliability.
✅ Customizable Solutions: Tailored pressure, temperature, and chamber size for specific needs.
✅ Global Support: Professional installation, training, and after-sales service.
Electronics: Prevents oxidation during soldering and component assembly.
Batteries: Ensures uniform drying of electrodes for optimal performance.
Aerospace: Removes volatile contaminants from critical components.
Research: Enables controlled chemical reactions and material testing.
For technical specifications, customization options, or a free consultation, please contact our sales team.
