Developing temperature testing equipment for semiconductor memory chips involves more than achieving a specified temperature range. High-density sample loading, continuous electrical operation, internal heat generation, and temperature consistency all need to be considered in the equipment design.
DANBLE worked with a semiconductor technology company to develop a customized temperature testing solution for powered memory chip testing. The equipment features two independent testing zones, with a temperature range of -40°C to +100°C and a loaded temperature uniformity requirement of ≤± 2.5°C. Condensation prevention was another essential requirement.
The project followed a prototype-first development process. DANBLE provided an initial prototype for customer evaluation, proceeded with mass production of 18 units after the prototype passed the customer's testing, and completed delivery and on-site commissioning in Vietnam.
This project demonstrates the complete process of customized semiconductor testing equipment development, from initial design validation to batch production and on-site implementation.
The customer required specialized environmental testing equipment for memory chips operating under controlled temperature conditions. Since the products remain powered on during testing, the equipment needed to accommodate both the specified thermal environment and the heat generated by the samples.
The compact internal space and multi-layer sample arrangement added further requirements for temperature distribution and airflow management.
The main project specifications were:
Parameter | Specification |
|---|---|
Application | Semiconductor memory chip testing |
Equipment quantity | 18 units |
Testing zone configuration | Two testing zones per unit |
Internal dimensions (W × D × H) | 400 × 280 × 1,400 mm per zone |
Temperature range | -40°C to +100°C |
Sample rack configuration | 60 layers |
Product capacity | 60 memory chips |
Sample load | 30 kg |
Heat dissipation | 1.6 kW |
Operating condition | Powered-on testing |
Loaded temperature uniformity | ≤± 2.5°C |
Condensation requirement | No condensation water during testing |
Delivery destination | Vietnam |
Project status | Prototype validated; 18 units mass-produced, delivered, and commissioned |
The equipment incorporates two testing zones within a compact structure. Each zone has internal dimensions of 400 × 280 × 1,400 mm, allowing the equipment layout to be tailored to the customer's specific sample arrangement and testing requirements.
A dual-zone configuration requires careful consideration of the internal layout, thermal management, and airflow distribution. These factors are particularly important when testing semiconductor products that generate heat during operation.
The equipment design was developed around the customer's required temperature range, sample capacity, and loaded testing conditions.
During powered semiconductor testing, heat generated by the products can affect the temperature distribution throughout the testing space.
With a 60-layer sample rack and a specified heat dissipation load of 1.6 kW, maintaining consistent temperatures across the sample arrangement was a key engineering consideration.
The target was a loaded temperature uniformity of no more than ± 2.5°C. Achieving this requirement involves coordinating the thermal control system with internal airflow and sample placement, rather than evaluating temperature performance solely under empty conditions.
The customer also required the equipment to operate without generating condensation water during testing.
Moisture control is an important consideration in semiconductor applications, where condensation around products or electrical connections can interfere with testing conditions.
The relationship between temperature, ambient humidity, surface temperature, and the dew point must therefore be considered in the equipment design and test procedure. The condensation requirement formed part of the project's technical specifications and acceptance considerations.
An important part of this project was the staged development process.
Rather than proceeding directly to the full production quantity, DANBLE first supplied a prototype for customer evaluation. This allowed the customer to assess the proposed equipment against its application requirements before committing to the complete batch.
The project proceeded through three main stages:
Stage 1 — Prototype Development
DANBLE developed the customized equipment according to the required temperature range, dual-zone structure, sample rack configuration, powered testing conditions, temperature uniformity target, and condensation prevention requirement.
Stage 2 — Customer Testing and Validation
The prototype was provided to the customer for testing. Following successful customer validation, the project moved forward to the mass production stage.
This step established a basis for proceeding with the agreed equipment configuration before manufacturing the full quantity.
Stage 3 — Mass Production of 18 Units
After the prototype passed the customer's testing, DANBLE proceeded with mass production of all 18 units. The completed equipment was delivered to Vietnam, where on-site commissioning was also completed.
This prototype-first approach provided a practical way to validate the proposed solution before scaling up production for a specialized semiconductor application.
The project did not end with equipment manufacturing. Following successful prototype validation and batch production, all 18 units were delivered to Vietnam, and on-site commissioning was completed.
For customized semiconductor testing equipment, installation and commissioning are important parts of the overall delivery process. The equipment must be brought into operation in its intended working environment, with its configuration aligned with the customer's application and operating requirements.
Completing the prototype validation, mass production, delivery, and on-site commissioning stages brought the project from an initial technical requirement to an implemented testing solution.
This project highlights several practical considerations for customized semiconductor temperature testing equipment.
Application-specific design: The equipment was developed around the customer's sample configuration, temperature range, powered operation, and thermal load.
Dual-zone configuration: Two testing zones were incorporated into the equipment structure to suit the required testing arrangement.
Loaded temperature control: The design requirements addressed temperature uniformity under powered testing conditions, not just the nominal temperature range.
Prototype-based validation: Customer testing of the prototype took place before the 18-unit production batch proceeded.
Complete project implementation: The work extended beyond manufacturing to delivery and on-site commissioning in Vietnam.
For semiconductor manufacturers and technology companies, these factors are important when selecting a supplier for specialized environmental testing equipment intended for repeatable production or reliability testing processes.
Yes. Customized equipment can be developed around the product dimensions, operating heat load, temperature range, sample capacity, and required temperature uniformity. Powered testing requires particular attention to the heat generated by the samples during operation.
Prototype validation allows the customer to evaluate the proposed configuration under the intended application conditions before the full production quantity is manufactured. It provides an opportunity to confirm the design against agreed technical requirements before scaling up production.
Key considerations include thermal management, airflow distribution, sample positioning, temperature uniformity, and the interaction between the two testing zones. The specific design depends on the equipment configuration and the customer's test requirements.
Project delivery can include on-site commissioning according to the agreed project scope and installation requirements. In this semiconductor project, all 18 units were delivered to Vietnam and on-site commissioning was completed.
From prototype development and customer validation to mass production and on-site commissioning, this semiconductor project involved the complete implementation of a customized temperature testing solution.
The final batch comprised 18 units, each featuring two testing zones designed for semiconductor memory chip applications. The equipment was specified for operation between -40°C and +100°C, with a 60-layer sample rack, powered testing, a loaded temperature uniformity requirement of ≤± 2.5°C, and no condensation water during testing.
For applications with specific sample arrangements and demanding thermal requirements, a prototype-based development process helps connect equipment design, customer validation, and batch production.
DANBLE develops customized environmental testing equipment for semiconductor and electronic applications, with project solutions tailored to specific testing requirements.
