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Production Overview
The Up-Down Basket Thermal Shock Chamber is engineered to simulate extreme temperature cycling environments, evaluating how materials, components, and assemblies withstand sudden thermal changes.
Its key design advantage lies in the automatic vertical lift basket system: instead of moving the test zones, the basket (holding samples) smoothly elevates or lowers between the integrated high-temperature zone (up to 180℃) and low-temperature zone (down to -70℃), minimizing mechanical stress on samples and ensuring repeatable test conditions.
Dual-Zone Configuration: Independent high/low-temperature zones with precise PID temperature control, achieving temperature uniformity of ±2℃ in each zone.
Lift Basket System: Auto-lift mechanism with adjustable speed (5-15mm/s) and load capacity (up to 20kg), compatible with various sample sizes.
Safety Protection: Equipped with over-temperature alarm, over-current protection, lift basket position sensor, and door interlock—preventing equipment damage and ensuring operator safety.
Compliance & Connectivity: Meets IEC 60068-2-14, GB/T 2423.22, and ASTM D1148 standards; supports data logging via USB/PC software for test curve analysis.
Forced air circulation via high-performance fans and optimized ducts ensures uniform temperature distribution(±0.5℃ stability).
Insulation design: Multi-layered (stainless steel + polyurethane foam) to minimize heat loss and maintain efficiency.
PID-programmable controllers (e.g., ±0.1°C resolution) with real-time data logging and curve visualization.
Integrated safety systems: Over-temperature/under-temperature alarms, compressor overload protection, and leakage detection.
RS-485/USB communication for data export and integration with PC software.
Application Scenarios
Widely used for testing electronic components (e.g., semiconductors, connectors), automotive parts (e.g., sensors, ECUs), and aerospace components—verifying their reliability under harsh thermal shock conditions, such as rapid temperature shifts between -40℃ and 120℃. The chamber’s compact design (compared to three-zone models) saves floor space, making it suitable for both laboratory and production-line testing environments.
Why Choose Us?
ISO 9001 Certified Manufacturer with 13+ years of R&D experience
Customizable Configurations: Support non-standard sizes and temperautre ranges per project needs.
Global Compliance: Meets IEC, GB, GJB, and UL standards
Global Recognition: Trusted by Fortune 500 companies and R&D labs worldwide.
Production Overview
The Up-Down Basket Thermal Shock Chamber is engineered to simulate extreme temperature cycling environments, evaluating how materials, components, and assemblies withstand sudden thermal changes.
Its key design advantage lies in the automatic vertical lift basket system: instead of moving the test zones, the basket (holding samples) smoothly elevates or lowers between the integrated high-temperature zone (up to 180℃) and low-temperature zone (down to -70℃), minimizing mechanical stress on samples and ensuring repeatable test conditions.
Dual-Zone Configuration: Independent high/low-temperature zones with precise PID temperature control, achieving temperature uniformity of ±2℃ in each zone.
Lift Basket System: Auto-lift mechanism with adjustable speed (5-15mm/s) and load capacity (up to 20kg), compatible with various sample sizes.
Safety Protection: Equipped with over-temperature alarm, over-current protection, lift basket position sensor, and door interlock—preventing equipment damage and ensuring operator safety.
Compliance & Connectivity: Meets IEC 60068-2-14, GB/T 2423.22, and ASTM D1148 standards; supports data logging via USB/PC software for test curve analysis.
Forced air circulation via high-performance fans and optimized ducts ensures uniform temperature distribution(±0.5℃ stability).
Insulation design: Multi-layered (stainless steel + polyurethane foam) to minimize heat loss and maintain efficiency.
PID-programmable controllers (e.g., ±0.1°C resolution) with real-time data logging and curve visualization.
Integrated safety systems: Over-temperature/under-temperature alarms, compressor overload protection, and leakage detection.
RS-485/USB communication for data export and integration with PC software.
Application Scenarios
Widely used for testing electronic components (e.g., semiconductors, connectors), automotive parts (e.g., sensors, ECUs), and aerospace components—verifying their reliability under harsh thermal shock conditions, such as rapid temperature shifts between -40℃ and 120℃. The chamber’s compact design (compared to three-zone models) saves floor space, making it suitable for both laboratory and production-line testing environments.
Why Choose Us?
ISO 9001 Certified Manufacturer with 13+ years of R&D experience
Customizable Configurations: Support non-standard sizes and temperautre ranges per project needs.
Global Compliance: Meets IEC, GB, GJB, and UL standards
Global Recognition: Trusted by Fortune 500 companies and R&D labs worldwide.
