Multi-layer Rapid Temperature Change Chamber

Product Details

Multi-Layer Rapid Temperature Change Test Chamber

Accelerated Reliability Testing for High-Volum Industrial Applications

|Core Functionality

The Multi-layer Rapid Temperature Change Chamber simulates thermal cycling environments to evaluate product reliability under accelerated stress conditions. Desined with stacked independent shelves, it enables simultaneour testing of multiple batches, significantly enhancing efficiency for high-volum production validation.

|Product Features

1. High-speed Thermal Cycling

Transition Rates: 5℃/min, 10℃/min, 15℃/min;

Temperature Range: -70℃ to +180℃(extendable with liquid nitrogen cooling);

Uniformity: ≤1.5℃ across all shelves;

2. Multi-layer Optimization

Independent Shel Control: Customizable temperature profiles per layer;

Capacity: Up to 2000L(e.g., 1000×1000×1000mm chamber), supporting large or dense loads;

Airflow Design: 1:3 product-to -chamber volume ratio ensures optimal airflow;

3. Energy Efficiency & Compliance

Cooling Technology: Advanced cooling control system reduces energy consumption;

Control System: Touchscreen PLC with real-time cures;

Safety Protection: Leakage/overload cutoff, automatic defrost;

Construction: SUS 304 stainless steel interior, anti-corrosion exterior;

Standards: IEC 60068, MIL-STD-810G

|Applications

Electronics: PCB/IC thermal validation, solder joint fatigue testing

Automotive: ECU durability, sensor performance under rapid transitions

Aerospace: MIL-STD-810G compliance for avionics and materials

|Parameters

|Why Choose Multi-layer Design?

Thourghput Boost: Test 3-5x more samples vs. Single-layer chambers

Cost Efficiency: Reduce lab space and energy costs per unit tested.

Flexibility: Configure shelves for mixed-product batches(e.g.,sensors +batteries)