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Multilayer Fast Thermal Cycling Test Test Chamber
Multilayer Fast Thermal Cycling Test Test Chamber Multilayer Fast Thermal Cycling Test Test Chamber
Multilayer Fast Thermal Cycling Test Test Chamber Multilayer Fast Thermal Cycling Test Test Chamber

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Multilayer Fast Thermal Cycling Test Test Chamber

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 Rapid Temperature Change Test Chamber is suitable for aerospace devices,  3C electronic components,  automotive parts, and various industrial products to test their various performance under high and low temperature rapidly changing environments.
  • DBT3-1000D3

  • Danble

Availability:
Quantity:

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 Product Description

Multi-layer Rapid Temperature Change Test Chamber

Accelerated Reliability Testing for High-Volume Industrial Applications

Core Functionality

The Multi-layer Rapid Temperature Change Test Chamber simulates extreme thermal cycling environments to evaluate product reliability under accelerated stress conditions. Designed with stacked independent shelves, it enables simultaneous testing of multiple batches, significantly enhancing efficiency for high-volume production validation. 

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 Product Features

  1. High-Speed Thermal Cycling

    • Transition Rates: 5°C/min, 10°C/min, 15°C/min

    • Temperature Range: -70°C to +180°C (extendable with liquid nitrogen cooling)

    • Uniformity: ≤±1.5°C across all shelves

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  2. Multi-layer Optimization

    • Independent Shelf Control: Customizable temperature profiles per layer

    • Capacity: Up to 2000L (e.g., 1000×1000×1000mm chamber), supporting large or dense loads.

    • Airflow Design: 1:3 product-to-chamber volume ratio ensures optimal airflow

    风道

  3. Energy Efficiency & Compliance

    • Cooling Technology: Advanced cooling control system reduces energy consumption

    • Control System: Touchscreen PLC with real-time cures.

    • Safety Protection: Leakage/overload cutoff, automatic defrost.

    • Construction: SUS304 stainless steel interior, anti-corrosion exterior.

    • Standards: JEDEC JESD22-A104B, IEC 60068, MIL-STD-2164

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 Applications

  • Electronics: PCB/IC thermal validation, solder joint fatigue testing

  • Automotive: ECU durability, sensor performance under rapid transitions

  • Aerospace: MIL-STD-810G compliance for avionics and materials

微信截图_20250606100935


| Parameters


Model DBT3-1000D3
Interior Dimension(mm) 1250×800×1000
External Dimension(mm) 1600×2100×1970
Heating/Cooling Rate
5℃/min, 10℃/min, 15℃/min(Linear)
Temperature Range -40℃ to 150℃  (-70℃ is available)
Fast Temperature Range -40℃ to 85℃
Humidity Range 10~98% RH
Temperature Deviation ≤2℃
Temperature Fluctuation ≤±0.5℃
Cooling way Water-cooling
Power
AC380V, 50Hz, Three-phase 5 wires


Why Choose Multi-layer Design?
  • Throughput Boost: Test 3–5x more samples vs. single-layer chambers

  • Cost Efficiency: Reduce lab space and energy costs per unit tested.

  • Flexibility: Configure shelves for mixed-product batches (e.g., sensors + batteries)


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  Company Name: Kunshan Danbo Instrument Co., Ltd.
  Tel: +86-0512-57685766
  E-mail: admin@danbleclimate.com
  Address: Room 27, No. 367 Youbi Rd, Zhoushi Town, Kunshan, Jiangsu, China
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